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2017年VLSI-TSA征稿通知


大家好,


2017年的VLSI会议将于2017年4月24到26日在台湾新竹召开,欢迎大家踊跃投稿,投稿截止日期是10月31日。

通知word附件:2017VLSI


First Call for Papers



2017 International Symposium on


SINCE 1983


VLSI Technology, Systems and Applications (2017 VLSI-TSA)

The 2017 International Symposium on VLSI Technology Systems and Applications will be held on April 24-26, 2017 at the Ambassador Hotel Hsinchu, Taiwan. The symposium offers a unique opportunity to network with leading experts in the field from around the globe. Original and unpublished papers on all aspects on VLSI technology and manufacturing are solicited.


SCOPE OF THE SYMPOSIUM

Low power CMOS and embedded memory

Foundry technology

RF process, device and integration technology

Standalone memory: DRAM, FLASH, emerging memory technology

Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc.

Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc.

Power and analog IC device and technology


Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D nanowires

Material, Process and device modeling

TFT and organic electronics

MEMS, imagers and sensors

Advanced manufacturing technology, metrology and yield

Reliability physics, characterization and test

Advanced packaging and 2.5D/3D Integration

Photonics and Beyond CMOS Technology

Energy harvesting technology

Wearable and loE enabling technologies


Camera-ready manuscript (2 pages including figures and tables) should be submitted electronically through the conference website at http://expo.itri.org.tw/2017vlsitsa. Accepted papers MUST be presented by one of the authors at the conference to warrant the paper publication in the conference proceedings. The presentation must be in English and will be limited to 15 minutes with an additional 5 minutes for discussion. All paper presenters are required to register for the symposium. All papers presented at the symposium will be published in the proceedings as submitted without revisions.

STUDENT SUBSIDY

Financial support for attending VLSI-TSA 2017 is available for full-time student presenters living outside of Taiwan, and up to 85% discount for all students in registration fee.

BEST PAPER AWARD

The selection will be based on the evaluation by members of technical committees of students papers, as well as their oral presentations during the conference. The Best Student Paper Awards will be granted to the winning students at the next conference.

IMPORTANT DATES

Paper Submission Deadline (not extendable)

Oct. 31, 2016

Notification of Acceptance

Dec. 31, 2016

Late News Paper Submission Deadline

Jan. 15, 2017

Author Registration Deadline

Feb. 28, 2017

(Note: All are based on Taiwan time, which is eight hours ahead of Greenwich Mean Time (GMT).)


2017 Technical Program Co-chairs

Michael Wu

TSMC, Taiwan

E-mail: sywua@tsmc.com


Ming-Jer Kao

Industrial Technology Research Institute, Taiwan E-mail: MJKAO@itri.org.tw